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Model 212
$5,600.00
Model 212 – Tabletop Mask Aligner for substrates up to 300mm
- Designed for substrates up to 12” (300 x300 mm)
- Precision alignment
- Low cost R&D tool for large area substrates
- Used for pkg, displays and 300mm wafers
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Model 800E
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- One touch from standard view to wide angle view with
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AML Wafer Bonder – Activate, Align and Bond all in one system
Original price was: $76,800.00.$46,500.00Current price is: $46,500.00.Add to cart• In situ alignment with 1um accuracy
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• Eliminates need for external mask aligner
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bond tooling
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Model 6020
$56,000.00Add to cartModel 6020 – Large Substrate ExposureSystem for RDL Panel Level PKG or Glass Panels
- 1st level exposure prints mask on substrates
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- Lamp power 8kw
- Stand alone system or fully integrated into customer’s line
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TS580
$56,895.00Add to cart- Temperature change rate is fast, -55 0C toThe conversion between+ 1 25 0C is about 1 0 seconds
- Temperature range of-80 0 C to +225 0 C
- Compact and mobile design
- Touch screen operation, human-computer interaction interface
- Fast DUT temperature stabilization time
- Temperature control accuracy ± 1 oc, display accuracy ± 0.1 oc
- Air up to 18 SCFM
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UV-Litho-ACA
$550.00Add to cart- Minimum Line width: 1.0um
- Minimum Feature size: 0.8 um
- Writing Speed: 3 mm2/min @ 1um
- 20mm2/min @ 1.5um
- Light source: LED 405nm / 385nm
- XY distance: 55mm
- Overlay Accuracy: 350nm
- minimum sample size: 3mm x 3mm
- Maximum sample size: 150mm x 150 mm
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