Only logged in customers who have purchased this product may leave a review.
Model 6020
$56,000.00
Model 6020 – Large Substrate ExposureSystem for RDL Panel Level PKG or Glass Panels
- 1st level exposure prints mask on substrates
- Optional Flood Exposure
- Substrate size 20” x20” with 24”x24” mask inserts
- Lamp power 8kw
- Stand alone system or fully integrated into customer’s line
- Available with robotic handling
Related products
-
UV-Litho-ACA
$550.00Add to cart- Minimum Line width: 1.0um
- Minimum Feature size: 0.8 um
- Writing Speed: 3 mm2/min @ 1um
- 20mm2/min @ 1.5um
- Light source: LED 405nm / 385nm
- XY distance: 55mm
- Overlay Accuracy: 350nm
- minimum sample size: 3mm x 3mm
- Maximum sample size: 150mm x 150 mm
-
ATC860
$6,485.00Add to cart• Temperature range of -70°C to +200°C
• Temperature stability ± 0.5 °C
• Touch screen operation, human-computer interaction interface
• Support OUT control
• Desktop design, low noise, low vibration, and low environmental heat dissipation
• Low temperature fluctuations
• Low temperature environment testing without condensation -
UV-Litho-Y
$6,400.00Add to cart- Minimum Line width: 1.5um
- Minimum Feature size: 1.2um
- Writing Speed: 10 mm2/min @ 1.5um
- Light source: LED 405nm / 385nm
- XY distance: 55mm
- Overlay Accuracy: 500nm
- Minimum sample size: 3mm x 3mm
- Maximum sample size: 50mm x 50 mm
-
Model 32
$7,900.00Add to cartModel 32 – UV LED Collimated Lightsource
For demanding applications. Standalone or integrated intoan OAI lithography system
- Beam size 4” to 12”
- Wavelengths available: 365nm, 405nm, and 436nm
- Long life, low cost, energy efficient
- Optional single level and multilevel tooling modules
- Matches Model 30 in collimation and functionality
-
AML Wafer Bonder – Activate, Align and Bond all in one system
Original price was: $76,800.00.$46,500.00Current price is: $46,500.00.Add to cart• In situ alignment with 1um accuracy
• Used for eutectic, anodic, direct, glass fruit, thermal compression, adhesive, SLID, and custom wafer bonding.
• Eliminates need for external mask aligner
• Available: Anodic silicon direct and thermal compression
bond tooling
• Contact and bonding with forces up to 40KN
• Autovapor injection
• Wafers held in separation
• User interface
Reviews
There are no reviews yet.