Shop
Showing 1–16 of 174 results
-
AML Wafer Bonder – Activate, Align and Bond all in one system
Original price was: $76,800.00.$46,500.00Current price is: $46,500.00.Add to cart• In situ alignment with 1um accuracy
• Used for eutectic, anodic, direct, glass fruit, thermal compression, adhesive, SLID, and custom wafer bonding.
• Eliminates need for external mask aligner
• Available: Anodic silicon direct and thermal compression
bond tooling
• Contact and bonding with forces up to 40KN
• Autovapor injection
• Wafers held in separation
• User interface -
ATC860
$6,485.00Add to cart• Temperature range of -70°C to +200°C
• Temperature stability ± 0.5 °C
• Touch screen operation, human-computer interaction interface
• Support OUT control
• Desktop design, low noise, low vibration, and low environmental heat dissipation
• Low temperature fluctuations
• Low temperature environment testing without condensation -
-
-
CIQTEK DB500 Focused Ion Beam FESEM Microscope
Read more• Electron Beam System
Gun type: High brightness Schottky Plus Field Emission Electron Gun
Resolution: 1.2 nm@15 kV
Acceleration Voltage 20 V ~ 30 kV
• Ion Beam System
Gun type: Liquid gallium ion source Resolution: 3 nm@30 kV
Acceleration Voltage 500 V ~ 30 kV
• Camera: Triple Optical navigation + sample chamber monitoring x2.
• Stage Type: Eucentric stage
• Stage Range: X=110 mm Y=110 mm / T: -10° ~+70°, Z=65 mm R: 360° -
CIQTEK SEM5000X FESEM Microscope
Read more• Resolution: 0.6 nm @ 15 kV, SE / 1.0 nm @ 1 kV, SE
• Acceleration Voltage 0.02kV ~ 30 kV
• Magnification 1 ~ 2,500,000 x
• Electron Gun Type: Schottky Field Emission Electron Gun
• Cameras: Optical navigation + Chamber monitor
• Stage Type: 5-Axis Mechanical Eu centric
• Stage Range: X=110 mm, Y=110 mm, Z=65 mm, T: -10*~+70°, R: 360° -
-
-
-
-
-
-
-
-
-
