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Model 30
$7,800.00
Model 30 – UV Collimated Lightsource
Standalone or integrated into any mask aligner or exposure system• Available with near, mid, or deep UV
- Mercury Arc and Mercury Xenon lamps
- Highly uniform beam at exposure plain
- Low collimation half angle
- Power up to 12.5 kw
- Pictured with optional stand
- Optional Single Level Tooling Module
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Model 2012
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• Handles 200 or 300mm wafers (8” -12”)
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Model 6000A
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TS580
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Model 200
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- Flexible with easy change of substrates and masks
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Options:
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AML Wafer Bonder – Activate, Align and Bond all in one system
Original price was: $76,800.00.$46,500.00Current price is: $46,500.00.Add to cart• In situ alignment with 1um accuracy
• Used for eutectic, anodic, direct, glass fruit, thermal compression, adhesive, SLID, and custom wafer bonding.
• Eliminates need for external mask aligner
• Available: Anodic silicon direct and thermal compression
bond tooling
• Contact and bonding with forces up to 40KN
• Autovapor injection
• Wafers held in separation
• User interface
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