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Model 6020
$56,000.00
Model 6020 – Large Substrate ExposureSystem for RDL Panel Level PKG or Glass Panels
- 1st level exposure prints mask on substrates
- Optional Flood Exposure
- Substrate size 20” x20” with 24”x24” mask inserts
- Lamp power 8kw
- Stand alone system or fully integrated into customer’s line
- Available with robotic handling
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Model 6000A
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Model 2000
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AML Wafer Bonder – Activate, Align and Bond all in one system
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• Used for eutectic, anodic, direct, glass fruit, thermal compression, adhesive, SLID, and custom wafer bonding.
• Eliminates need for external mask aligner
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bond tooling
• Contact and bonding with forces up to 40KN
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• User interface
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